0.11 ultra-low leakage
overview
csmc 0.11 ull process uses aluminum interconnects, 1p8m architecture, offering 1.5v core device and 3.3v i/o device with ultra-low-leakage features, typical ioff (pa/um)<0.5.
key features
- single poly, eight-metal-layer process
- al backend with low-k fsg material
- device ioff (typical) <0.5 pa/um
applications
- mcu
- iot
0.11 ull flash
overview
csmc 0.11 ull flash process technology is embedded flash based on 0.11 ull, core device is compatible with ull process, offering ultra-low power analog ip.
key features
- double poly, eight-metal-layer process
- al backend with low-k fsg material
- competitive flash macro cell size
application
- mcu
- iot